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Electronic encapsulation adhesives, particularly epoxy resins, are crucial for providing heat dissipation, electrical insulation, and environmental protection in electronic packaging, with ongoing research focused on improving their thermal stability, moisture resistance, and performance for integrated circuits.
Epoxy resin has become a key material for electronic packaging due to its excellent heat resistance, insulation and processability, but in the future it needs to be further improved in thermal conductivity, low stress and environmental performance to meet the needs of high-performance integrated circuits.
Epoxy resin coatings have excellent chemical properties, adhesion and insulation properties, but poor weather resistance. They are mostly used in anti-corrosion coatings, metal primers and insulating paints.
Epoxy adhesive is a versatile two-component bonding material known for its strong adhesion, chemical and heat resistance, and wide industrial applications.
Solid epoxy resin is a thermosetting polymer material that is solid (in the form of granules, flakes, or powder) at room temperature. Mainly used in powder coatings, electronic packaging, adhesives and composite materials.
Common issues in river table production include glue failure to solidify due to incorrect mixing ratios, insufficient blending, high humidity, or improper storage, as well as bubbles caused by excessive stirring or improper sealing of wood; these can be addressed with careful mixing, proper storage, and bubble elimination techniques.
