Epoxy resin AB glue refers to a general term for a three-dimensional cross-linked curing compound that contains two or more epoxy groups in a molecular structure and can form under appropriate chemical reagents and appropriate conditions.
According to chemical structure, it can be divided into glycidyl ethers, glycidyl esters, glycidyl amines, cycloaliphatic epoxy resins, epoxy resins containing inorganic elements, new epoxy resins (hydantoin epoxy resin, imide amine epoxy resin, etc.) etc.
Among all kinds of epoxy resins, bisphenol A epoxy resin is the one with the largest output and the widest use. According to its molecular weight, it can be divided into low, medium, high and ultra-high molecular weight epoxy resins (polyphenolic resins). Low molecular weight resins can be cured at room temperature or high temperature, but high molecular weight epoxy resins must be cured at high temperatures, while ultra-high molecular weight polyphenolic resins do not require curing agents and can form tough films at high temperatures .
Application:
Epoxy resin AB glue can be cured at low temperature or normal temperature, and the curing speed is fast; after curing, the adhesive strength is high, the hardness is good, and it has a certain toughness; and atmospheric aging; has good electrical and physical properties such as good insulation, compressive strength, and high bonding strength. The following will explain the use of epoxy resin AB glue.
1. Any electronic or other products that need to be quickly bonded and fixed can be used;
2. It is widely used in the bonding and fixing of electronic components, handicrafts and gifts. It has excellent bonding strength for packaging and bonding between metals, ceramics, wood, glass and hard plastics;
3. It is not suitable for the bonding of elastic or soft materials.
