Industrial application of epoxy resin potting glue

Potting is an important application field of epoxy resin. It has been widely used in the electronic device manufacturing industry and is an important insulating material that is indispensable to the electronics industry. Potting is to mechanically or manually fill the liquid epoxy resin compound into the device with electronic components and circuits, and solidify it under normal temperature or heating conditions to become a thermosetting polymer insulating material with excellent performance. Its functions are: to strengthen the integrity of electronic devices and improve resistance to external impact and vibration; to improve the insulation between internal components and circuits, which is conducive to the miniaturization and lightweight of devices; to avoid direct exposure of components and circuits, and to improve the waterproof and moisture-proof performance of devices. Epoxy potting glue has a wide range of applications, with very different technical requirements and a wide variety of varieties. From the perspective of curing conditions, it can be divided into two categories: room temperature curing and heating curing. From the perspective of dosage form, it can be divided into two categories: two-component and single-component.

Multi-component formulations are not common as commodities due to their inconvenience in use. Room temperature curing epoxy potting glue is generally a two-component one. It can be cured without heating after potting. It has low requirements for equipment and is easy to use. The disadvantages are that the compound has a large working viscosity, poor permeability, short application period, and it is difficult to achieve automated production. In addition, the heat resistance and electrical properties of the cured product are not very high. It is generally used for potting low-voltage electronic devices or in places where heating and curing are not suitable. Heating-curing two-component epoxy potting glue is the variety with the largest usage and the widest application. Its characteristics are low working viscosity of the compound, good processability, long application period, good permeability, and excellent comprehensive performance of the cured product. It is suitable for the automatic production line of high-voltage electronic devices. Single-component epoxy potting material is a new variety developed abroad in recent years and requires heating and curing. Compared with two-component heating-curing potting glue, the outstanding advantages are that the required potting equipment is simple, easy to use, and the quality of the potting glue is less dependent on the equipment and process. In addition, the disadvantages are that the cost is high and the material storage conditions are strict. The epoxy potting glue used should meet the following requirements:

1.Good performance,long applicability,suitable for large-scale automatic production line operation.

2.Low viscosity,strong penetration,can fill components and wires.

3. During the potting and curing process, powder components such as fillers have little sedimentation and no stratification.

4. The curing exothermic peak is low and the curing shrinkage is small.