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Sinopec Epoxy Resin Curing Agent DMP-30

DMP-30 is used as a curing catalyst for thermosetting epoxy resin adhesives. It c.an greatly increase the reaction rate between the curing agent and the epoxy resin and reduce the curing temperature without affecting the physical and chemical properties of the adhesive
Availability:

  • DMP-30

  • Sinopec

Usage of Curing Agent DMP-30

Anti-corrosion coatings, pouring floor concrete protection and adhesives

Product Description:

DMP-30 is used as a curing catalyst for thermosetting epoxy resin adhesives. It can greatly increase the reaction rate between the curing agent and the epoxy resin and reduce the curing temperature without affecting the physical and chemical properties of the adhesive. Compared with other curing agents, it has better catalytic effect and complete reaction. It is generally suitable for low-temperature, high-temperature resistant and low-molecular-weight rubber-modified epoxy adhesives and adhesives for certain special purposes and special processes.

Detailed Photos:

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Packaging& Shipping:

200kg/drum

3

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